ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,807, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Joonghy... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,808, issued on Nov. 3, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor device having grounded buried o... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,809, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including inactive element, asse... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,810, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including inactive element, asse... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,811, issued on Nov. 3, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufact... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,812, issued on Nov. 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Bonded structure with interconnect... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,813, issued on Nov. 3, was assigned to Volantis Semiconductor Inc. (Portland, Ore.). "Back side power delivery for wafer-scale integration w... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,814, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Packaging architecture with edge ring anchoring" was invented by ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,815, issued on Nov. 3, was assigned to TANAKA PRECIOUS METAL TECHNOLOGIES Co. Ltd. (Tokyo). "Interposer substrate and method for producing d... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,817, issued on Nov. 3, was assigned to Lux Semiconductors Inc. (Albany, N.Y.). "Metal core substrate based package interconnect systems" was... Read More